IBM to Produce Micron's Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability

Micron's Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias,” shown above. IBM’s new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube. Read the news release: www.ibm.com/press/us/en/pressrelease/36125.wss

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Taken on November 29, 2011